Recrutement Packaging Corporation of America

1 offre de recrutement pour Packaging Corporation of America :

Recrutement Field Apps Engineer - PVD, Etch

KLA Corporation - Montbonnot-Saint-Martin, Isère

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... in Europe, North America and Asia-Pacific, and offers comprehensive service and spare parts support through a worldwide network......

19 octobre 2025