1 offre de recrutement pour Packaging Corporation of America :
Recrutement Field Apps Engineer - PVD, Etch
KLA Corporation - Montbonnot-Saint-Martin, Isère
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... in Europe, North America and Asia-Pacific, and offers comprehensive service and spare parts support through a worldwide network......
19 octobre 2025