Annonce recrutement Recrutement Micron Boise, ID
121 offres de recrutement sur 12 pages pour Micron Boise, ID :
Recrutement BU Analyst - Catalyst Rotation Program
Candidates should demonstrate the following: Quick-learner, ambitious, and adaptable Self-starter who is motivated and energized to work in ambiguous and changing environments Proactive, problem solver who is analytical and data-driven Acti......
9 octobre 2025
Recrutement Toxic Gas Monitoring (TGM) Technician
Conduct and review Job Hazard Analyses (JHA), follow change management procedures, and ensure compliance with PPE, lockout/tagout, and chemical safety protocols. Identify and resolve chronic equipment alarms and defects; assist with install......
8 octobre 2025
Recrutement Principal Thermal Simulation Engineer, APTD
Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Wafer (COW), Flip Chip, Through Silicon Vias (TSV), etc Detailed understanding of package......
8 octobre 2025
Recrutement Staff Business Manager
Collaborate on Demand Forecasting: Work with sales, marketing, and partners to generate unconstrained demand forecasts, analyze demand changes and evaluate scenarios for informed decisions. Improve Customer & Market Engagement: Consolidate ......
8 octobre 2025
Recrutement Emergency Services Specialist
Respond to medical emergencies, chemical spills/leaks, gas releases, HAZMAT incidents, and confined space/high angle rescues. Serve as Emergency Response Team (ERT) Captain and direct all response personnel during emergencies. Document inci......
8 octobre 2025
Recrutement Principal Category Supplier Manager
Supplier & Site Management - Lead site supplier performance, relationship management, and own procurement processes for designated areas and accounts. Category Management & Strategic Sourcing - Recommend resource levels across sourcing cate......
8 octobre 2025
Recrutement Staff Design Engineer, TSV Packaging
Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM) and Flip Chip. Detailed understanding of thermal compression bonding process for chip-on-wafer and wafer-to-wafer hybrid bondi......
8 octobre 2025
Recrutement DRAM Memory Design Engineer, Principal | MST | SMTS
Responsibilities include managing project activities, maintaining technical expertise through cross-group communication and training, and driving innovation in future memory generations. Contribute to the Design and Layout of New Memory Pro......
8 octobre 2025
Recrutement Senior Engineer, Global Facilities - Mechanical
Manage large-scale projects, including U.S. Greenfield FABs, with a focus on engineering innovation, sustainability, and operational excellence. Collaborate cross-functionally with Manufacturing, IT, Procurement, Construction, and other tea......
5 octobre 2025
Recrutement Senior Process Engineer, APTD
Optimizing processes and equipment to reduce cost, process variability, and improve process capability. Collaborating with Equipment teams, Process Development and Process Integration to develop innovative new solutions. Enabling automation......
5 octobre 2025